These pure aluminium heat sinks include thermal tape that transfers heat efficiently to the heat sink, providing additional cooling for the IC. The contours of these heat sinks are perfectly adapted to the Raspberry Pi 4B standard. A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. A heat sink transfers thermal energy from a higher-temperature device to a lower-temperature fluid medium.

The fluid medium is frequently air, but can also be water, refrigerants or oil. If the fluid medium is water, the heat sink is frequently called a cold plate. When the airflow through the heat sink decreases, this results in an increase in the average air temperature. This in turn increases the heat sink base temperature. Additionally, the thermal resistance of the heat sink will also increase. The net result is a higher heat sink base temperature.

Features:

• High quality, made of aluminium alloy, it will not rust.
• The contours of these heat sinks are perfectly adapted to the Raspberry Pi 4B standard.
• Thermal conductive adhesive tape backing
• Can be applied with other devices such as BeagleBone, VRAM VGA RAM, IC Chips, MOSFET SCR, Southbridge, Northbridge etc
• Reduce chip hot spots and increase thermal dissipation surface area

Installation Method:

This heatsink has an adhesive film on the back. It is very easy to mount it on the BGA chip. Just remove the protective film on the back of the heatsink and press it gently to the BGA chip. The heatsink will stick to the BGA chip and cool it.

The new Raspberry Pi 4B aluminium heat sink could help you solve this trouble. These pure aluminium heat sinks include thermal tape that transfers heat efficiently to the heat sink, providing additional cooling for the IC. The contours of these heat sinks are perfectly adapted to the Raspberry Pi 4B standard.

A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. A heat sink transfers thermal energy from a higher-temperature device to a lower-temperature fluid medium. The fluid medium is frequently air, but can also be water, refrigerants or oil.

If the fluid medium is water, the heat sink is frequently called a cold plate. When the airflow through the heat sink decreases, this results in an increase in the average air temperature. This in turn increases the heat sink base temperature. Additionally, the thermal resistance of the heat sink will also increase. The net result is a higher heat sink base temperature.

Features:

• High quality, made of aluminium alloy, it will not rust.
• The contours of these heat sinks are perfectly adapted to the Raspberry Pi 4B standard.
• Thermal conductive adhesive tape backing
• Can be applied with other devices such as BeagleBone, VRAM VGA RAM, IC Chips, MOSFET SCR, Southbridge, Northbridge etc
• Reduce chip hot spots and increase thermal dissipation surface area

Installation Method:

This heatsink has an adhesive film on the back. It is very easy to mount it on the BGA chip. Just remove the protective film on the back of the heatsink and press it gently to the BGA chip. The heatsink will stick to the BGA chip and cool it.

These pure aluminium heat sinks include thermal tape that transfers heat efficiently to the heat sink, providing additional cooling for the IC. The contours of these heat sinks are perfectly adapted to the Raspberry Pi 4B standard. A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. A heat sink transfers thermal energy from a higher-temperature device to a lower-temperature fluid medium.

The fluid medium is frequently air, but can also be water, refrigerants or oil. If the fluid medium is water, the heat sink is frequently called a cold plate. When the airflow through the heat sink decreases, this results in an increase in the average air temperature. This in turn increases the heat sink base temperature. Additionally, the thermal resistance of the heat sink will also increase. The net result is a higher heat sink base temperature.

Features:

• High quality, made of aluminium alloy, it will not rust.
• The contours of these heat sinks are perfectly adapted to the Raspberry Pi 4B standard.
• Thermal conductive adhesive tape backing
• Can be applied with other devices such as BeagleBone, VRAM VGA RAM, IC Chips, MOSFET SCR, Southbridge, Northbridge etc
• Reduce chip hot spots and increase thermal dissipation surface area

Installation Method:

This heatsink has an adhesive film on the back. It is very easy to mount it on the BGA chip. Just remove the protective film on the back of the heatsink and press it gently to the BGA chip. The heatsink will stick to the BGA chip and cool it.

These pure aluminium heat sinks include thermal tape that transfers heat efficiently to the heat sink, providing additional cooling for the IC. The contours of these heat sinks are perfectly adapted to the Raspberry Pi 4B standard. A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. A heat sink transfers thermal energy from a higher-temperature device to a lower-temperature fluid medium.

The fluid medium is frequently air, but can also be water, refrigerants or oil. If the fluid medium is water, the heat sink is frequently called a cold plate. When the airflow through the heat sink decreases, this results in an increase in the average air temperature. This in turn increases the heat sink base temperature. Additionally, the thermal resistance of the heat sink will also increase. The net result is a higher heat sink base temperature.

Features:

• High quality, made of aluminium alloy, it will not rust.
• The contours of these heat sinks are perfectly adapted to the Raspberry Pi 4B standard.
• Thermal conductive adhesive tape backing
• Can be applied with other devices such as BeagleBone, VRAM VGA RAM, IC Chips, MOSFET SCR, Southbridge, Northbridge etc
• Reduce chip hot spots and increase thermal dissipation surface area

Features:

• Fast Heat Dissipation
• Corrosion / Oxidation Resisting
• Dedicated Aluminum Heatsink
• Using With CM4 Base Board
• Simple Version Heatsink, Easy to Install
• Matching With The CM4 On Size And Mounting Holes

Features:

• Compatible with Jetson Nano Module, with elastic bracket and height-limited screws
• Easy to Install: Mounting holes & screws included.
• The function of this aluminum heat sink is to cool down the board and make it operate safely
• The aluminium heat sink can reduce the risk of hardware failure because of overheating
• Essential for high-performance computing: Keeps module temperatures low to avoid overheating and throttling.
• Safe for Use: The spring mounting interface keeps excessive pressure off the Jetson Nano module.

These pure aluminium heat sinks include thermal tape that transfers heat efficiently to the heat sink, providing additional cooling for the IC. The contours of these heat sinks are perfectly adapted to the Raspberry Pi 4B standard. A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. A heat sink transfers thermal energy from a higher-temperature device to a lower-temperature fluid medium.

The fluid medium is frequently air, but can also be water, refrigerants or oil. If the fluid medium is water, the heat sink is frequently called a cold plate. When the airflow through the heat sink decreases, this results in an increase in the average air temperature. This in turn increases the heat sink base temperature. Additionally, the thermal resistance of the heat sink will also increase. The net result is a higher heat sink base temperature.

Features:

• High quality, made of aluminium alloy, it will not rust.
• The contours of these heat sinks are perfectly adapted to the Raspberry Pi 4B standard.
• Thermal conductive adhesive tape backing
• Can be applied with other devices such as BeagleBone, VRAM VGA RAM, IC Chips, MOSFET SCR, Southbridge, Northbridge etc
• Reduce chip hot spots and increase thermal dissipation surface area

Installation Method:

This heatsink has an adhesive film on the back. It is very easy to mount it on the BGA chip. Just remove the protective film on the back of the heatsink and press it gently to the BGA chip. The heatsink will stick to the BGA chip and cool it.

This Universal Heat Sink is of size 25 x 25 x 10 mm (L x W x H) which can be used for multipurpose applications suitable to be installed with a 25 x 25 or more sized cooling fan over it.

Features:

• Prevents overheating of board
• Absorbs heat quickly
• Fast cooling
• Quantity of blade: 8
• Material: Aluminum
• Colour: Silver

Specifications:

• Material: Aluminium
• Colour: White

Compatible With:

• Stepper Motor Driver Boards(A4988 and DRV8825)
• Raspberry Pi
• Beaglebone Advanced Controller Board

These ceramic finned heat sinks are constructed from an entirely new material structure that moves heat by air circulation (without external force). Due to its micro-porous nature, it provides a vast surface area compared with traditional heat sinks which ensures highly efficient heat dissipation.

Features:

• Made of aluminium and ceramic
• Very convenient for cooling your devices.
• Pre-applied thermal conductive adhesive material
• Simple installation
• Exclusively made for Raspberry Pi B+, Raspberry Pi 2

How to use:

• Clean the surface of the electronic components, to ensure there is without greasy and debris, etc., to keep the surface dry
• Tear off the protective film on the back of the heatsink
• Attach the heat sink to the required cooling chip, press the heatsink 2 or 3 times